Lead-free soldering process development and reliability /
edited by Jasbir Bath, Bath Consultancy LLC.
- 1 online resource (xxii, 481 pages) : illustrations
- Wiley series in quality & reliability engineering .
- Wiley series in quality and reliability engineering. .
Includes bibliographical references and index.
"This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"--
9781119482093 1119482097 1119482046 9781119482048
2020004970
Electronic packaging.
Solder and soldering.
Electronic packaging.
Solder and soldering.
Electronic books.
TK7870.15 / .L434 2020
621.381/046
Includes bibliographical references and index.
"This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"--
9781119482093 1119482097 1119482046 9781119482048
2020004970
Electronic packaging.
Solder and soldering.
Electronic packaging.
Solder and soldering.
Electronic books.
TK7870.15 / .L434 2020
621.381/046