Electromagnetic compatibility (EMC) design and test case analysis / (Record no. 69027)
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000 -LEADER | |
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fixed length control field | 04547cam a2200517Ii 4500 |
001 - CONTROL NUMBER | |
control field | on1086380840 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20220711203503.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 190220s2019 si ob 001 0 eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
ISBN | 9781118956847 |
-- | (electronic bk. ; |
-- | oBook) |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
ISBN | 1118956842 |
-- | (electronic bk. ; |
-- | oBook) |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
-- | (print) |
029 1# - (OCLC) | |
OCLC library identifier | AU@ |
System control number | 000065194497 |
029 1# - (OCLC) | |
OCLC library identifier | CHNEW |
System control number | 001039349 |
029 1# - (OCLC) | |
OCLC library identifier | CHVBK |
System control number | 559028121 |
082 04 - CLASSIFICATION NUMBER | |
Call Number | 621.38 |
100 1# - AUTHOR NAME | |
Author | Zheng, Junqi, |
245 10 - TITLE STATEMENT | |
Title | Electromagnetic compatibility (EMC) design and test case analysis / |
300 ## - PHYSICAL DESCRIPTION | |
Number of Pages | 1 online resource |
505 0# - FORMATTED CONTENTS NOTE | |
Remark 2 | Intro; Title Page; Copyright Page; Contents; Preface; Exordium; Introduction; Chapter 1 The EMC Basic Knowledge and the Essence of the EMC Test; 1.1 What Is EMC?; 1.2 Conduction, Radiation, and Transient; 1.3 Theoretical Basis; 1.3.1 Time Domain and Frequency Domain; 1.3.2 The Concept of the Unit for Electromagnetic Disturbance, dB; 1.3.3 The True Meaning of Decibel; 1.3.4 Electric Field, Magnetic Field, and Antennas; 1.3.5 Resonance of the RLC Circuit; 1.4 Common Mode and Differential Mode in the EMC Domain; 1.5 Essence of the EMC Test; 1.5.1 Essence of the Radiated Emission Test |
505 8# - FORMATTED CONTENTS NOTE | |
Remark 2 | 1.5.2 Essence of the Conducted Emission Test1.5.3 Essence of the ESD Immunity Test; 1.5.4 Essence of the Radiated Immunity Test; 1.5.5 Essence of the Common-Mode Conducted Immunity Test; 1.5.6 Essence of the Differential-Mode Conducted Immunity Test; 1.5.7 Differential-Mode and Common-Mode Hybrid Conducted Immunity Test; Chapter 2 Architecture, Shielding, and Grounding Versus EMC of the Product; 2.1 Introduction; 2.1.1 Architecture Versus EMC of the Product; 2.1.2 Shielding Versus EMC of the Product; 2.1.3 Grounding Versus EMC of the Product; 2.2 Analyses of Related Cases |
505 8# - FORMATTED CONTENTS NOTE | |
Remark 2 | 2.2.1 Case 1: The Conducted Disturbance and the Grounding2.2.2 Case 2: The Ground Loop During the Conducted Emission Test; 2.2.3 Case 3: Where the Radiated Emission Outside the Shield Comes From; 2.2.4 Case 4: The "Floating" Metal and the Radiation; 2.2.5 Case 5: Radiated Emission Caused by the Bolt Extended Outside the Shield; 2.2.6 Case 6: The Compression Amount of the Shield and Its Shielding Effectiveness; 2.2.7 Case 7: The EMI Suppression Effectiveness of the Shielding Layer Between the Transformer's Primary Winding and Secondary Winding in the Switching-Mode Power Supply |
505 8# - FORMATTED CONTENTS NOTE | |
Remark 2 | 2.2.8 Case 8: Bad Contact of the Metallic Casing and System Reset2.2.9 Case 9: ESD Discharge and the Screw; 2.2.10 Case 10: Heatsink Also Affects the ESD Immunity; 2.2.11 Case 11: How Grounding Benefits EMC Performance; 2.2.12 Case 12: The Heatsink Shape Affects Conducted Emissions from the Power Ports; 2.2.13 Case 13: The Metallic Casing Oppositely Causes the EMI Test Failed; 2.2.14 Case 14: Whether Directly Connecting the PCB Reference Ground to the Metallic Casing Will Lead to ESD |
505 8# - FORMATTED CONTENTS NOTE | |
Remark 2 | 2.2.15 Case 15: How to Interconnect the Digital Ground and the Analog Ground in the Digital-Analog Mixed DevicesChapter 3 EMC Issues with Cables, Connectors, and Interface Circuits; 3.1 Introduction; 3.1.1 Cable Is the Weakest Link in the System; 3.1.2 The Interface Circuit Provides Solutions to the Cable Radiation Problem; 3.1.3 Connectors Are the Path Between the Interface Circuit and the Cable; 3.1.4 The Interconnection Between the PCBs Is the Weakest Link of the Product EMC; 3.2 Analyses of Related Cases; 3.2.1 Case 16: The Excessive Radiation Caused by the Cabling |
856 40 - ELECTRONIC LOCATION AND ACCESS | |
Uniform Resource Identifier | https://doi.org/10.1002/9781118956847 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | eBooks |
264 #1 - | |
-- | Singapore : |
-- | Wiley, |
-- | 2019. |
336 ## - | |
-- | text |
-- | txt |
-- | rdacontent |
337 ## - | |
-- | computer |
-- | c |
-- | rdamedia |
338 ## - | |
-- | online resource |
-- | cr |
-- | rdacarrier |
588 0# - | |
-- | Online resource; title from PDF title page (John Wiley, viewed February 20, 2019). |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electromagnetic compatibility. |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electromagnetic interference. |
650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electromagnetic compatibility. |
-- | (OCoLC)fst00906512 |
650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electromagnetic interference. |
-- | (OCoLC)fst00906551 |
994 ## - | |
-- | 92 |
-- | DG1 |
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