Contactless VLSI Measurement and Testing Techniques (Record no. 78805)

000 -LEADER
fixed length control field 03557nam a22005295i 4500
001 - CONTROL NUMBER
control field 978-3-319-69673-7
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220801220649.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 171116s2018 sz | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9783319696737
-- 978-3-319-69673-7
082 04 - CLASSIFICATION NUMBER
Call Number 621.3815
100 1# - AUTHOR NAME
Author Sayil, Selahattin.
245 10 - TITLE STATEMENT
Title Contactless VLSI Measurement and Testing Techniques
250 ## - EDITION STATEMENT
Edition statement 1st ed. 2018.
300 ## - PHYSICAL DESCRIPTION
Number of Pages V, 93 p. 34 illus., 11 illus. in color.
505 0# - FORMATTED CONTENTS NOTE
Remark 2 1. Conventional Test Methods. – 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.
520 ## - SUMMARY, ETC.
Summary, etc This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://doi.org/10.1007/978-3-319-69673-7
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Cham :
-- Springer International Publishing :
-- Imprint: Springer,
-- 2018.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic circuits.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microprocessors.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Computer architecture.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronics.
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic Circuits and Systems.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Processor Architectures.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronics and Microelectronics, Instrumentation.
912 ## -
-- ZDB-2-ENG
912 ## -
-- ZDB-2-SXE

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