RF and Microwave Microelectronics Packaging II (Record no. 80984)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04043nam a22005295i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-319-51697-4 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220801222628.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 170310s2017 sz | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783319516974 |
| -- | 978-3-319-51697-4 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.381 |
| 245 10 - TITLE STATEMENT | |
| Title | RF and Microwave Microelectronics Packaging II |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2017. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | XII, 172 p. 127 illus., 77 illus. in color. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Chapter1. Introduction to RF and Microwave Microelectronic Packaging -- Chapter2. Packaging of Transmit/Receive Modules -- Chapter3. 3D Transitions and Connections -- Chapter4. Electromagnetic Shielding for RF & Microwave Packages -- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate -- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package -- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices -- Chapter8. The challenge in packaging and assembly the advanced power amplifiers -- Chapter9. High Thermal Conductivity Materials – Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond -- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging -- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Kuang, Ken. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Sturdivant, Rick. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-3-319-51697-4 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Cham : |
| -- | Springer International Publishing : |
| -- | Imprint: Springer, |
| -- | 2017. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Telecommunication. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microwaves, RF Engineering and Optical Communications. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic Circuits and Systems. |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 912 ## - | |
| -- | ZDB-2-SXE |
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