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Heat Transfer and Pressure Drop in Flow Boiling in Microchannels [electronic resource] / by Sujoy Kumar Saha, Gian Piero Celata.

By: Saha, Sujoy Kumar [author.].
Contributor(s): Celata, Gian Piero [author.] | SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: SpringerBriefs in Applied Sciences and Technology: Publisher: Cham : Springer International Publishing : Imprint: Springer, 2016Description: X, 55 p. 40 illus., 16 illus. in color. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783319202853.Subject(s): Engineering | Fluids | Thermodynamics | Heat engineering | Heat transfer | Mass transfer | Fluid mechanics | Engineering | Engineering Thermodynamics, Heat and Mass Transfer | Engineering Fluid Dynamics | Fluid- and AerodynamicsAdditional physical formats: Printed edition:: No titleDDC classification: 621.4021 Online resources: Click here to access online
Contents:
1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
In: Springer eBooksSummary: This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Micro channels," by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
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1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Micro channels," by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

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