Print version record.

Front Cover -- Surfactants in Precision Cleaning -- Copyright Page -- Contents -- List of Contributors -- About the Editors -- Preface -- 1 Introduction to Surfactants -- 1 Introduction -- 2 Hydrophilicity and Hydrophobicity of Surfactant Molecules -- 3 Adsorption Mechanism -- 4 Surface Tension -- 5 Enhancement of Wettability -- 6 Langmuir-Blodgett Films -- 7 Krafft Point -- 8 Surfactant States -- 9 Micelles -- 10 Microemulsions -- 11 Surfactant Mixtures -- 12 Adsorption at Surface/Interface -- 12.1 Adsorption Basics -- 12.2 Adsorption Isotherms -- 12.3 Adsorption Thermodynamics

12.4 Adsorption Kinetics -- 13 Surfactant Aggregation and the Aqueous cmc -- 14 Surfactant Partitioning Between Water and Oil -- 15 Surfactant Precipitate and Colloid Formation -- 16 Salt/Ion Effects on Surfactant Behavior -- 17 Summary -- Acknowledgment -- References -- 2 Surface Contaminants and Surface Cleanliness Levels -- 1 Introduction -- 2 Sources and Generation of Contaminants -- 2.1 Particles -- 2.1.1 Forces of Adhesion -- 2.2 Thin-Film or Molecular Contamination -- 2.3 Ionic Contamination -- 2.4 Metallic Contaminants -- 2.4.1 Metal Impurities and Particles -- 2.5 Microbial Contamination

3 Impact of Contaminants -- 3.1 Particle Contamination -- 3.1.1 Health Effects -- 3.2 Molecular Contamination -- 3.3 Ionic Contamination and Metallic Contaminants -- 3.4 Microbial Contamination -- 4 Product Surface Cleanliness Levels -- 4.1 Surface Cleanliness -- 5 Summary -- Acknowledgment -- Disclaimer -- References -- 3 The Use of Surfactants in Enhanced Particle Removal During Cleaning -- 1 Introduction -- 1.1 Industrial Perspective -- 1.2 Historical Perspective -- 2 Surfactant Behavior in Solution -- 3 Interaction Forces and Particle Removal -- 3.1 Introduction to Interaction Forces

3.2 Measurement of Surface Forces -- 3.3 Adhesion -- 3.4 Particle Removal Forces -- 3.5 Modification of Surface Forces Using Surfactants -- 3.6 Measurement of Particle Removal -- 3.7 Enhanced Particle Removal Results Associated With Surfactant Use -- 3.8 Postcleaning Surfactant Removal -- 3.9 Selection of Surfactants for Cleaning Purposes -- 3.10 Mathematical Modeling of Enhanced Particle Removal Using Surfactants -- 4 Summary -- Acknowledgment -- References -- 4 Particle Removal by Surfactants During Semiconductor Cleaning -- 1 Introduction -- 1.1 Si Wafer Cleaning

1.2 Post-Chemical Mechanical Planarization (PCMP) Cleaning -- 2 Overview of Particle Removal by Surfactants During Semiconductor Cleaning -- 2.1 Surfactant Types, Characteristics, and Their Uses -- 2.2 Mechanisms of Particle Removal in the Presence of Surfactants -- 3 Application of Surfactants for Particle Removal During Semiconductor Cleaning -- 3.1 Silicon Wafer Cleaning -- 3.2 Post-CMP Cleaning Process -- 3.2.1 Si Post-CMP Cleaning -- 3.2.2 Oxide Post-CMP Cleaning -- 3.2.3 Metal Post-CMP Cleaning -- 3.2.4 III-V Material Post-CMP Cleaning -- 4 Summary -- References