Design of 3D integrated circuits and systems / 
edited by Rohit Sharma, Indian Institute of Technology Ropar, Punjab, India; Krzysztof Iniewski, managing editor, CMOS Emerging Technologies Research Incorporated, Vancouver, British Columbia, Canada ; foreword by Sung Kyu Lim. 
 - 1 online resource. 
 - Devices, circuits, and systems .
 - Devices, circuits, and systems. .
<br/><br/>1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang. 
<br/><br/><label>ISBN: </label>9781466589421 9781315215709 9781351822909 
<br/><br/><label>Standard No.: </label>10.1201/9781315215709   doi 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Three-dimensional integrated circuits.
<br/><br/><label>LC Class. No.: </label>TK7874.893  / .D48 2014 
<br/><br/><label>Dewey Class. No.: </label>621.3815  / D457