Through silicon vias : materials, models, design, and performance - Kaushik, Brajesh Kumar; Alam, Arsalan; Kumar, Vobulapuram Ramesh; Majumder, Manoj Kumar (Boca Raton : CRC Press, 2017)
1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
Keywords: Three-dimensional integrated circuits; Interconnects (Integrated circuit technology)