000 | 02838nam a22005655i 4500 | ||
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001 | 978-981-4451-21-5 | ||
003 | DE-He213 | ||
005 | 20200421111649.0 | ||
007 | cr nn 008mamaa | ||
008 | 130321s2013 si | s |||| 0|eng d | ||
020 |
_a9789814451215 _9978-981-4451-21-5 |
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024 | 7 |
_a10.1007/978-981-4451-21-5 _2doi |
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050 | 4 | _aTA169.7 | |
050 | 4 | _aT55-T55.3 | |
050 | 4 | _aTA403.6 | |
072 | 7 |
_aTGPR _2bicssc |
|
072 | 7 |
_aTEC032000 _2bisacsh |
|
082 | 0 | 4 |
_a658.56 _223 |
100 | 1 |
_aTan, Cher Ming. _eauthor. |
|
245 | 1 | 0 |
_aElectromigration Modeling at Circuit Layout Level _h[electronic resource] / _cby Cher Ming Tan, Feifei He. |
264 | 1 |
_aSingapore : _bSpringer Singapore : _bImprint: Springer, _c2013. |
|
300 |
_aIX, 103 p. 75 illus., 2 illus. in color. _bonline resource. |
||
336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
||
490 | 1 |
_aSpringerBriefs in Applied Sciences and Technology, _x2191-530X |
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505 | 0 | _aIntroduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion. | |
520 | _aIntegrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. . | ||
650 | 0 | _aEngineering. | |
650 | 0 | _aAtoms. | |
650 | 0 | _aPhysics. | |
650 | 0 | _aElectronic circuits. | |
650 | 0 | _aQuality control. | |
650 | 0 | _aReliability. | |
650 | 0 | _aIndustrial safety. | |
650 | 1 | 4 | _aEngineering. |
650 | 2 | 4 | _aQuality Control, Reliability, Safety and Risk. |
650 | 2 | 4 | _aElectronic Circuits and Devices. |
650 | 2 | 4 | _aAtomic, Molecular, Optical and Plasma Physics. |
700 | 1 |
_aHe, Feifei. _eauthor. |
|
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer eBooks | |
776 | 0 | 8 |
_iPrinted edition: _z9789814451208 |
830 | 0 |
_aSpringerBriefs in Applied Sciences and Technology, _x2191-530X |
|
856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-981-4451-21-5 |
912 | _aZDB-2-ENG | ||
942 | _cEBK | ||
999 |
_c54284 _d54284 |