| 000 | 03785nam a22005295i 4500 | ||
|---|---|---|---|
| 001 | 978-1-4614-5761-9 | ||
| 003 | DE-He213 | ||
| 005 | 20200421111657.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 130919s2014 xxu| s |||| 0|eng d | ||
| 020 |
_a9781461457619 _9978-1-4614-5761-9 |
||
| 024 | 7 |
_a10.1007/978-1-4614-5761-9 _2doi |
|
| 050 | 4 | _aTJ163.12 | |
| 072 | 7 |
_aTDPB _2bicssc |
|
| 072 | 7 |
_aTEC009070 _2bisacsh |
|
| 072 | 7 |
_aTEC008070 _2bisacsh |
|
| 082 | 0 | 4 |
_a629.8 _223 |
| 100 | 1 |
_aChauhan, Preeti S. _eauthor. |
|
| 245 | 1 | 0 |
_aCopper Wire Bonding _h[electronic resource] / _cby Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G Pecht. |
| 264 | 1 |
_aNew York, NY : _bSpringer New York : _bImprint: Springer, _c2014. |
|
| 300 |
_aXXVI, 235 p. 104 illus., 20 illus. in color. _bonline resource. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
||
| 347 |
_atext file _bPDF _2rda |
||
| 505 | 0 | _aCopper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding. | |
| 520 | _aThis critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes-bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond-pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond-pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond-pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology. | ||
| 650 | 0 | _aEngineering. | |
| 650 | 0 | _aMechatronics. | |
| 650 | 0 | _aIndustrial engineering. | |
| 650 | 0 | _aOptical materials. | |
| 650 | 0 | _aElectronic materials. | |
| 650 | 1 | 4 | _aEngineering. |
| 650 | 2 | 4 | _aMechatronics. |
| 650 | 2 | 4 | _aOperating Procedures, Materials Treatment. |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 700 | 1 |
_aChoubey, Anupam. _eauthor. |
|
| 700 | 1 |
_aZhong, ZhaoWei. _eauthor. |
|
| 700 | 1 |
_aPecht, Michael G. _eauthor. |
|
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 776 | 0 | 8 |
_iPrinted edition: _z9781461457602 |
| 856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-1-4614-5761-9 |
| 912 | _aZDB-2-ENG | ||
| 942 | _cEBK | ||
| 999 |
_c54787 _d54787 |
||