000			13034nam a2201381 i 4500
001			5236490
003			IEEE
005			20200421114110.0
006			m o d
007			cr |n|||||||||
008			151221s2005 njua ob 001 eng d
020			_a9780471776338 _qelectronic
020			_z047170959X _qcloth : alk. paper
020			_z9780471709596 _qcloth : print
020			_z0471776297 _qelectronic
020			_z9780471776291 _qelectronic
020			_z0471776335 _qelectronic
024	7		_a10.1002/0471776335 _2doi
035			_a(CaBNVSL)mat05236490
035			_a(IDAMS)0b00006481094ae8
040			_aCaBNVSL _beng _erda _cCaBNVSL _dCaBNVSL
050		4	_aTK7874.75 _b.R67 2006eb
082	0	4	_a621.381/044 _222
100	1		_aRossetti, Nazzareno, _d1951-
245	1	0	_aManaging power electronics : _bVLSI and DSP-driven computer systems / _cNazzareno Rossetti.
246	3	0	_aVLSI and DSP-driven computer systems
264		1	_aHoboken, New Jersey : _bWiley, _cc2006.
264		2	_a[Piscataqay, New Jersey] : _bIEEE Xplore, _c[2005]
300			_a1 PDF (xix, 383 pages) : _billustrations.
336			_atext _2rdacontent
337			_aelectronic _2isbdmedia
338			_aonline resource _2rdacarrier
504			_aIncludes bibliographical references and index.
505	0		_aForeword -- Preface -- 1. Introduction -- 1.1 Technology Landscape -- 1.2 A Young Industry after All -- 2. Power Management Technologies -- 2.1 Introduction -- 2.2 Integrated Circuits Power Technology: Processing and Packaging -- Diodes and Bipolar Transistors -- Metal-Oxide-Semiconductor (MOS) Transistors -- DMOS Transistors -- CMOS Transistors -- Passive Components -- A Monolithic Process Example -- Packaging -- 2.3 Discrete Power Technology: Processing and Packaging -- From Wall to Board -- Power MOSFET Technology Basics -- Package Technologies -- 2.4 Ongoing Trends -- 3. Circuits -- PART I. ANALOG CIRCUITS -- 3.1 Transistors -- NPN -- PNP -- Trans-Conductance -- Transistor as Transfer-Resistor -- Transistor Equations -- MOS versus Bipolar Transistors -- 3.2 Elementary Circuits -- Current Mirror -- Current Source -- Differential Input Stage -- Differential to Single Input Stage -- Buffer -- 3.3 Operational Amplifier (Opamp) -- Inverting and Non-Inverting Inputs -- Rail to Rail Output Operation -- CMOS Opamp -- Opamp Symbol and Configurations -- DC Open Loop Gain -- AC Open Loop Gain -- 3.4 Voltage Reference -- Positive TC of ?VBE -- Negative TC of VBE -- Build a ?VBE -- Building a Voltage Reference -- Fractional Band-Gap Voltage Reference -- 3.5 Voltage Regulator -- 3.6 Linear versus Switching -- 3.7 Switching Regulators -- 3.8 Buck Converters -- Switching Regulator Power Train -- Output Capacitor -- Electrolytic Capacitors and Transient Response -- Ceramic Capacitors -- Losses in the Power Train -- The Analog Modulator -- Driver -- Switching Regulator Block Diagram -- Switching Regulator Control Loop -- Input Filter -- Input Inductor LIN -- Input Capacitor -- Current Mode -- 3.9 Flyback Converters -- PART II. DIGITAL CIRCUITS -- 3.10 Logic Functions -- NAND Gate -- Set-Reset R Flip-Flop -- Current Mode with Anti-Bouncing Flip-Flop -- 4. DC-DC Conversion Architectures -- 4.1 Valley Control Architecture -- Peak and Valley Control Architectures -- Transient Response of Each System.
505	8		_aValley Control with FAN5093 -- Conclusion -- 4.2 Monolithic Buck Converter -- A New Design Methodology for Faster Time to Market The Design Cycle -- The FAN5301 -- The Behavioral Model -- Light Load Operation -- Full Load Operation -- Over-Current -- One Shot -- Comparator -- Results -- Timing -- Conclusion -- 4.3 Active Clamp -- Introduction -- Application -- Test Results -- Comments -- 4.4 Battery Charging Techniques: New Solutions for Notebook Battery Chargers -- High Efficiency -- The Smart Battery System -- Data Conversion -- Fast Charge -- Battery Charger System -- 4.5 Digital Power -- Control Algorithm of Modern Switching Regulators: Analog or Digital? -- Fast Switchmode Regulators and Digital Control -- 5. Offline (AC-DC) Architectures -- 5.1 Offline Power Architectures -- Introduction -- Offline Control -- PFC Architecture -- DC-DC Conversion Down to Low Voltage -- Future Trends -- 5.2 Power AC Adapter: Thermal and Electrical Design -- Introduction: The Challenge -- AC Adapter Power Dissipation -- AC Adapter Case Temperature -- Active and No-load Operation -- Development of a Solution -- Conclusion -- 6. Power Management of Ultraportable Devices -- 6.1 Power Management of Wireless Computing and Communications Devices -- The Wireless Landscape -- Power Management Technologies for Wireless -- Cellular Telephones -- Wireless Handheld -- Charge -- Protection and Fuel Gauging -- Convergence of Cellular Telephone and Handheld -- Future Architectures -- 6.2 Power Management in Wireless Telephones: Subsystem Design Requirements -- Smart Phone Subsystems -- Display Board -- Keypad Board -- Main Board -- Battery Pack -- AC Adapter -- 6.3 Powering Feature-Rich Handsets -- Growing Complexity and Shrinking Cycle Time -- Power Management Unit -- Low Dropouts (LDOs) -- 6.4 More on Power Management Units in Cell Phones -- Barriers to Up-Integration -- PMU Building Blocks -- CPU Regulator -- Low Dropout Block -- The Microcontroller -- The Microcontroller Die -- Processing Requirements.
505	8		_aMicrocontroller-Driven Illumination System -- 6.5 Color Displays and Cameras Increase Demand on Power Sources and Management -- Digital Still Camera -- Camera Phones -- Power Minimization -- Untethered Operation -- 7. Computing and Communications Systems.
505	8		_a7.1 Power Management of Desktop and Notebook Computers -- Power Management System Solution for a Pentium III Desktop System -- Power Management System Solution for Pentium IV Systems (Desktop and Notebook) -- Desktop Systems -- Powering the Silver Box -- Notebook Systems -- Future Power Trends -- 7.2 Computing and Data Communications Converge at the Point of Load -- The Proliferation of Power Supplies -- Telecom Power Distribution -- Computing Power Distribution -- Multiphase Buck Converter for POLs and VRMs -- Conclusion -- 7.3 Efficient Power Management ICs Tailored for DDR-SDRAM Memories -- Introduction -- DDR Power Management Architecture -- Worst Case Current Consumption -- Average Power Consumption -- Transient Operation -- Standby Operation -- Linear versus Switching -- Second Generation DDR-DDR2 -- FAN5236 for DDR and DDR2 Memories -- Future Trends -- 7.4 Power Management of Digital Set-Top Boxes -- Set-Top Box Architecture -- Power Management -- High Power Set-Top Boxes -- Low Power Set-Top Boxes -- Conclusion -- 7.5 Power Conversion for the Data Communications Market -- Introduction -- Current Environment with Separate Networks -- Migration to Converged Voice/Data/Video IP -- Telecom -48 V DC Power Distribution -- Datacom AC Power Distribution -- Conclusion -- 8. Future Directions and Special Topics -- 8.1 Beyond Productivity and Toys: Designing ICs for the Health Care Market -- 8.2 Power Management Protocols Help Save Energy -- ACPI -- Motherboard (DC-DC) Voltage Regulators -- Offline (AC-DC) Voltage Regulators with Power -- Factor Correction (PFC) -- Green Power (Energy Management) -- New Low Power System Requirements -- Conclusion -- 8.3 Heat Disposal in Electronics Applications -- Active versus Passive Cooling --Limits of Passive Cooling -- Active Cooling -- Active Cooling-Yes or No? -- Active Cooling Implementation -- 8.4 Web Based Design Tools -- The Tools on the Web -- 8.5 Motor Drivers for Portable Electronic Appliances -- Introduction -- Camera Basics -- Motors and Motor Drivers -- Driving Implementation -- Efficiency -- DSC Power Consumption -- Conclusion -- Appendix A.Fairchild Specifications for FAN5093 -- Appendix B. Fairchild Specifications for FAN4803 -- Appendix C. Fairchild Specifications for FSD210 and FSD200 -- Appendix D. Fairchild Specifications for FAN5307 -- Appendix E. Fairchild Specifications for ACE1502 -- Appendix F. Fairchild Specifications for FAN5236 -- Appendix G. Fairchild Specifications for FAN8702 -- Glossary -- Further Reading -- Index.
506	1		_aRestricted to subscribers or individual electronic text purchasers.
520			_aA unique system focus that presents specific solutions for specific appliances This publication presents state-of-the-art power management techniques for modern electronic appliances that rely on such very large-scale integration (VLSI) chips as CPUs and DSPs. The author thoroughly covers all aspects of the field, including semiconductor manufacturing processes, packages, circuits, functions, and systems. A unique and significant contribution to the field, the publication adopts a "system focus" by first presenting the appliance and then delving into the power management architecture and topologies that best serve each appliance. In addition to specific techniques and applications, the publication discusses fundamental physical and socioeconomic issues. For example, the author examines Moore's law and its effect on power management and heat dissipation, which points to a future breakthrough needed to continue the fast pace of advancement in the high-tech industry. The author provides a solid technical foundation and an analysis of popular electronic appliances, including: * Overview of the semiconductor industry * Plain-English discussion of semiconductor processes and packages * Step-by-step guide to analog design building from the transistor to higher-level functions, leading to the implementation of a complete voltage regulator * Popular DC-DC voltage regulation architectures * AC-DC architectures for power conversion * Ultra-portable devices, such as cellular phones, PDAs, and digital still cameras * Desktop and notebook PCs The publication concludes with a chapter on special power management topics and an expert forecast of future directions for the field. This is essential reading for researchers, engineers, and designers in the semiconductor and integrated circuits industries. With its extensive use of cross-section drawings as well as transistor circuit schematics, this is also a recommended textbook for advanced undergraduate and graduate courses in computer science and electrical engineering.
530			_aAlso available in print.
538			_aMode of access: World Wide Web
588			_aDescription based on PDF viewed 12/21/2015.
650		0	_aIntegrated circuits _xVery large scale integration.
650		0	_aSemiconductors.
650		0	_aSignal processing _xDigital techniques.
655		0	_aElectronic books.
695			_aBibliographies
695			_aCMOS integrated circuits
695			_aCapacitors
695			_aCentral Processing Unit
695			_aCharge carrier processes
695			_aClocks
695			_aComputational modeling
695			_aComputer architecture
695			_aComputers
695			_aDigital signal processing
695			_aDriver circuits
695			_aEPROM
695			_aElectronics packaging
695			_aElectrostatic discharge
695			_aEngines
695			_aEnvironmentally friendly manufacturing techniques
695			_aEurope
695			_aFlip-flops
695			_aFrequency control
695			_aHarmonic analysis
695			_aHeating
695			_aIEC standards
695			_aImpedance
695			_aIndexes
695			_aIndustries
695			_aIntegrated circuit modeling
695			_aIntegrated circuits
695			_aIris
695			_aJunctions
695			_aLead
695			_aLogic gates
695			_aMOSFET circuits
695			_aMedical services
695			_aMemory management
695			_aMoment methods
695			_aOptimized production technology
695			_aPower MOSFET
695			_aPower electronics
695			_aPower harmonic filters
695			_aProgramming
695			_aProtocols
695			_aPulse width modulation
695			_aRandom access memory
695			_aRectifiers
695			_aRegulators
695			_aResistance
695			_aResistors
695			_aSemiconductor diodes
695			_aSensors
695			_aSilicon
695			_aSilver
695			_aSmart phones
695			_aSwitches
695			_aSystem-on-a-chip
695			_aTemperature distribution
695			_aTemperature measurement
695			_aTerminology
695			_aThermal resistance
695			_aTime frequency analysis
695			_aTransistors
695			_aTurning
695			_aVoltage control
695			_aVoltage measurement
695			_aWindings
695			_aWireless communication
695			_aWireless sensor networks
710	2		_aJohn Wiley & Sons, _epublisher.
710	2		_aIEEE Xplore (Online service), _edistributor.
776	0	8	_iPrint version: _z9780471709596
856	4	2	_3Abstract with links to resource _uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5236490
942			_cEBK
999			_c59305 _d59305