000 07469cam a2200625Ki 4500
001 on1083521812
003 OCoLC
005 20220711203459.0
006 m o d
007 cr cnu|||unuuu
008 190128s2019 njua ob 001 0 eng d
040 _aN$T
_beng
_erda
_epn
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_dDG1
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019 _a1083713890
_a1084441991
_a1085699194
020 _a9781119523512
_q(electronic book)
020 _a1119523516
_q(electronic book)
020 _a9781119523543
_q(electronic book)
020 _a1119523540
_q(electronic book)
020 _z9781119523536
020 _z1119523532
029 1 _aAU@
_b000065043718
029 1 _aAU@
_b000065193794
029 1 _aCHNEW
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029 1 _aCHVBK
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035 _a(OCoLC)1083521812
_z(OCoLC)1083713890
_z(OCoLC)1084441991
_z(OCoLC)1085699194
050 4 _aTK7871.95
_b.S24 2019
072 7 _aTEC
_x009070
_2bisacsh
082 0 4 _a621.3815/284
_223
049 _aMAIN
100 1 _aSahay, Shubham,
_eauthor.
_98073
245 1 0 _aJunctionless Field-Effect Transistors :
_bDesign, Modeling, and Simulation /
_cShubham Sahay, Mamidala Jagadesh Kumar.
264 1 _aHoboken, New Jersey :
_bJohn Wiley & Sons Inc.,
_c[2019]
300 _a1 online resource
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
490 1 _aIEEE Press series on microelectronic systems
504 _aIncludes bibliographical references and index.
520 _aA comprehensive one-volume reference on current JLFET methods, techniques, and research Advancements in transistor technology have driven the modern smart-device revolution-many cell phones, watches, home appliances, and numerous other devices of everyday usage now surpass the performance of the room-filling supercomputers of the past. Electronic devices are continuing to become more mobile, powerful, and versatile in this era of internet-of-things (IoT) due in large part to the scaling of metal-oxide semiconductor field-effect transistors (MOSFETs). Incessant scaling of the conventional MOSFETs to cater to consumer needs without incurring performance degradation requires costly and complex fabrication process owing to the presence of metallurgical junctions. Unlike conventional MOSFETs, junctionless field-effect transistors (JLFETs) contain no metallurgical junctions, so they are simpler to process and less costly to manufacture. JLFETs utilize a gated semiconductor film to control its resistance and the current flowing through it. Junctionless Field-Effect Transistors: Design, Modeling, and Simulation is an inclusive, one-stop reference on the study and research on JLFETs This timely book covers the fundamental physics underlying JLFET operation, emerging architectures, modeling and simulation methods, comparative analyses of JLFET performance metrics, and several other interesting facts related to JLFETs. A calibrated simulation framework, including guidance on SentaurusTCAD software, enables researchers to investigate JLFETs, develop new architectures, and improve performance. This valuable resource: -Addresses the design and architecture challenges faced by JLFET as a replacement for MOSFET -Examines various approaches for analytical and compact modeling of JLFETs in circuit design and simulation -Explains how to use Technology Computer-Aided Design software (TCAD) to produce numerical simulations of JLFETs -Suggests research directions and potential applications of JLFETs Junctionless Field-Effect Transistors: Design, Modeling, and Simulation is an essential resource for CMOS device design researchers and advanced students in the field of physics and semiconductor devices.
588 0 _aOnline resource; title from digital title page (viewed on March 20, 2019).
505 0 _aIntro; Junctionless Field-Effect Transistors; Contents; Preface; 1 Introduction to Field-Effect Transistors; 1.1 Transistor Action; 1.2 Metal-Oxide-Semiconductor Field-Effect Transistors; 1.2.1 "Field-Effect" and Operation Modes; 1.2.2 MOSFET as a Switch; 1.2.3 Transfer Characteristics and Output Characteristics; 1.3 MOSFET Circuits: The Need for Complementary MOS; 1.3.1 CMOS Inverter; 1.3.2 Power Dissipation in CMOS Inverter; 1.4 The Need for CMOS Scaling; 1.5 Moore's Law; 1.6 Koomey's Law; 1.7 Challenges in Scaling the MOSFET; 1.7.1 Short-Channel Effects; 1.7.2 Hot Electron Effect
505 8 _a1.7.3 Gate-Induced Drain Leakage1.7.4 Direct Source to Drain Tunneling; 1.7.5 Boltzmann Tyranny; 1.7.6 Ultrasteep Doping Profile; 1.8 Conclusion; References; 2 Emerging FET Architectures; 2.1 Tunnel FETs; 2.1.1 Structure; 2.1.2 Operation; 2.1.3 Challenges; 2.2 Impact Ionization MOSFET; 2.2.1 Structure; 2.2.2 Operation and Characteristics; 2.2.3 Challenges; 2.3 BIPOLAR I-MOS; 2.3.1 Structure; 2.3.2 Operation and Characteristics; 2.3.3 Challenges; 2.4 Negative capacitance FETs; 2.4.1 Negative Capacitance in Ferroelectric Materials; 2.4.2 Structure; 2.4.3 Operation and Characteristics
505 8 _a2.4.4 Challenges2.5 Two-Dimensional FETs; 2.5.1 Structure; 2.5.2 Operation; 2.5.3 Challenges; 2.6 Nanowire FETs; 2.6.1 Structure and Characteristics; 2.6.2 Gate-Induced Drain Leakage; 2.6.3 Challenges; 2.7 Nanotube FETs; 2.7.1 Structure; 2.7.2 Operation and Characteristics; 2.7.3 Gate-Induced Drain Leakage; 2.7.4 Dynamic Performance; 2.7.5 Impact of Spacer Material; 2.7.6 Impact of Core Diameter; 2.7.7 Challenges; 2.8 Conclusion; References; 3 Fundamentals of Junctionless Field-Effect Transistors; 3.1 Device Structure; 3.2 Operation; 3.2.1 Full Depletion; 3.2.2 Partial Depletion
505 8 _a3.2.3 Flat Band Condition3.2.4 Accumulation; 3.3 Design Parameters; 3.3.1 Fabrication Flow; 3.4 Parameters that Affect the Performance; 3.4.1 Mobility; 3.4.2 Impact of Strain on Mobility; 3.4.3 Carrier Ballisticity; 3.4.4 Temperature Dependence; 3.4.5 Bias Temperature Instability; 3.4.6 Low-Frequency Noise; 3.4.7 Short-Channel Effects; 3.5 Beyond Silicon JLFETs: Other Materials; 3.5.1 Germanium JLFETs; 3.5.2 Indium Gallium Arsenide JLFETs; 3.5.3 Gallium Nitride JLFETs; 3.6 Challenges; 3.6.1 High Source/Drain Series Resistance; 3.6.2 Random Dopant Fluctuations; 3.6.3 RDF in JLFETs
505 8 _a3.6.4 Sensitivity to Process Variations3.6.5 Fabrication Issues; 3.6.6 Band-to-Band Tunneling in OFF-State; 3.7 Conclusion; References; 4 Device Architectures to Mitigate Challenges in Junctionless Field-Effect Transistors; 4.1 Junctionless Accumulation-Mode Field-Effect Transistors; 4.1.1 Structure; 4.1.2 Operation; 4.1.3 Challenges; 4.2 Realizing Efficient Volume Depletion; 4.3 SOI JLFET With A High- Box; 4.3.1 Structure; 4.3.2 Transfer Characteristics; 4.3.3 Operation; 4.3.4 Impact of Gate Length Scaling; 4.3.5 Impact of BOX Thickness and Ground Plane Doping; 4.3.6 Impact of Traps
650 0 _aMetal semiconductor field-effect transistors.
_98074
650 7 _aTECHNOLOGY & ENGINEERING
_xMechanical.
_2bisacsh
_98075
650 7 _aMetal semiconductor field-effect transistors.
_2fast
_0(OCoLC)fst01017679
_98074
655 4 _aElectronic books.
_93294
700 1 _aKumar, Mamidala Jagadesh,
_eauthor.
_98076
776 0 8 _iPrint version:
_z1119523532
_z9781119523536
_w(OCoLC)1039924256
830 0 _aIEEE Press series on microelectronic systems.
_96746
856 4 0 _uhttps://doi.org/10.1002/9781119523543
_zWiley Online Library
942 _cEBK
994 _a92
_bDG1
999 _c69014
_d69014