| 000 | 03305cam a2200589Ii 4500 | ||
|---|---|---|---|
| 001 | on1245419748 | ||
| 003 | OCoLC | ||
| 005 | 20220711203655.0 | ||
| 006 | m o d | ||
| 007 | cr ||||||||||| | ||
| 008 | 201211s2021 gw fo 000 0 eng d | ||
| 040 |
_aUKAHL _beng _erda _epn _cUKAHL _dOCLCO _dUKMGB _dOCLCO _dDG1 _dOCLCF |
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| 015 |
_aGBC0J9522 _2bnb |
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| 016 | 7 |
_a020043536 _2Uk |
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| 020 |
_a9783527823239 _q(electronic bk. : oBook) |
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| 020 |
_a3527823239 _q(electronic bk. : oBook) |
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| 020 |
_a9783527823253 _q(e-book) |
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| 020 |
_a3527823255 _q(e-book) |
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| 020 |
_a9783527823246 _q(ePub ebook) |
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| 020 |
_a3527823247 _q(ePub ebook) |
||
| 020 | _z9783527346479 (hbk.) | ||
| 024 | 7 |
_a10.1002/9783527823239 _2doi |
|
| 029 | 1 |
_aUKMGB _b020043536 |
|
| 029 | 1 |
_aAU@ _b000068943357 |
|
| 035 | _a(OCoLC)1245419748 | ||
| 037 |
_a9783527823246 _bWiley |
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| 050 | 4 | _aTK7875 | |
| 082 | 0 | 4 |
_a621.38152 _223 |
| 049 | _aMAIN | ||
| 100 | 1 |
_aEsashi, Masayoshi, _d1949- _eauthor. _99842 |
|
| 245 | 1 | 0 |
_a3D and circuit integration of MEMS _cMasayoshi Esashi. |
| 264 | 1 |
_aWeinheim : _bWiley-VCH, _c2021. |
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| 300 | _a1 online resource | ||
| 336 |
_atext _2rdacontent |
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| 337 |
_acomputer _2rdamedia |
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| 338 |
_aonline resource _2rdacarrier |
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| 505 | 0 | _aFront Matter -- Overview / Masayoshi Esashi -- Bulk Micromachining / Xinxin Li, Heng Yang -- Enhanced Bulk Micromachining Based on MIS Process / Xinxin Li, Heng Yang -- Epitaxial Poly Si Surface Micromachining / Masayoshi Esashi -- Poly-SiGe Surface Micromachining / Carrie W Low, Sergio F Almeida, Emmanuel P Quvy, Roger T Howe -- Metal Surface Micromachining / Minoru Sasaki -- Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters / Enes Calayir, Srinivas Merugu, Jaewung Lee, Navab Singh, Gianluca Piazza -- MEMS Using CMOS Wafer / Weileun Fang, Sheng-Shian Li, Yi Chiu, Ming-Huang Li -- Wafer Transfer / Masayoshi Esashi -- Piezoelectric MEMS / T Takeshi Kobayashi (AIST) -- Anodic Bonding / Masayoshi Esashi -- Direct Bonding / Hideki Takagi -- Metal Bonding / Joerg Froemel -- Reactive Bonding / Klaus Vogel, Silvia Braun, Christian Hofmann, Mathias Weiser, Maik Wiemer, Thomas Otto, Harald Kuhn -- Polymer Bonding / Xiaojing Wang, Frank Niklaus -- Soldering by Local Heating / Yu-Ting Cheng, Liwei Lin -- Packaging, Sealing, and Interconnection / Masayoshi Esashi -- Vacuum Packaging / Masayoshi Esashi -- Buried Channels in Monolithic Si / Kazusuke Maenaka -- Through-substrate Vias / Zhyao Wang -- Index | |
| 590 | _bWiley Frontlist Obook All English 2021 | ||
| 650 | 0 |
_aMicroelectromechanical systems. _96063 |
|
| 650 | 0 |
_aSilicon-on-insulator technology. _99843 |
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| 650 | 0 |
_aIntegrated circuits. _99844 |
|
| 650 | 0 |
_aMetal oxide semiconductors, Complementary. _93260 |
|
| 650 | 7 |
_aIntegrated circuits. _2fast _0(OCoLC)fst00975535 _99844 |
|
| 650 | 7 |
_aMetal oxide semiconductors, Complementary. _2fast _0(OCoLC)fst01017635 _93260 |
|
| 650 | 7 |
_aMicroelectromechanical systems. _2fast _0(OCoLC)fst01019745 _96063 |
|
| 650 | 7 |
_aSilicon-on-insulator technology. _2fast _0(OCoLC)fst01118704 _99843 |
|
| 655 | 4 |
_aElectronic books. _93294 |
|
| 776 | 0 | 8 |
_iPrint version : _z9783527346479 |
| 856 | 4 | 0 |
_uhttps://doi.org/10.1002/9783527823239 _zWiley Online Library |
| 942 | _cEBK | ||
| 994 |
_a92 _bDG1 |
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| 999 |
_c69524 _d69524 |
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