000 01888cam a2200481Ii 4500
001 on1249564453
003 OCoLC
005 20220711203658.0
006 m o d
007 cr cnu|||unuuu
008 210504s2021 gw ob 001 0 eng d
040 _aDG1
_beng
_erda
_epn
_cDG1
_dOCLCO
_dYDX
_dUKAHL
019 _a1243743465
_a1245420582
020 _a9783527824199
_q(electronic bk.)
020 _a3527824197
_q(electronic bk.)
020 _z9783527346684
020 _a9783527824182
_q(electronic bk.)
020 _a3527824189
_q(electronic bk.)
020 _z3527346686
024 7 _a10.1002/9783527824199
_2doi
029 1 _aAU@
_b000069150886
035 _a(OCoLC)1249564453
_z(OCoLC)1243743465
_z(OCoLC)1245420582
050 4 _aTK7871.85
082 0 4 _a621.3815/2
_223
049 _aMAIN
100 1 _aLill, Thorsten,
_eauthor.
_99889
245 1 0 _aAtomic layer processing :
_bsemiconductor dry etching technology /
_cThorsten Lill.
264 1 _aWeinheim, Germany :
_bWiley-VCH,
_c2021.
300 _a1 online resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
505 0 _aIntroduction -- Fundamentals -- Thermal Etching -- Thermal Isotropic ALE -- Radical Etching -- Directional ALE -- Reactive Ion Etching -- Ion Beam Etching -- Etching Species Generation -- Emerging Etching Technologies.
504 _aIncludes bibliographical references and index.
588 0 _aOnline resource; title from PDF title page (John Wiley, viewed May 4, 2021).
590 _bWiley Frontlist Obook All English 2021
650 0 _aSemiconductors
_xEtching.
_99890
655 4 _aElectronic books.
_93294
776 0 8 _cOriginal
_z3527346686
_z9783527346684
_w(OCoLC)1083134617
856 4 0 _uhttps://doi.org/10.1002/9783527824199
_zWiley Online Library
942 _cEBK
994 _a92
_bDG1
999 _c69538
_d69538