000 | 01888cam a2200481Ii 4500 | ||
---|---|---|---|
001 | on1249564453 | ||
003 | OCoLC | ||
005 | 20220711203658.0 | ||
006 | m o d | ||
007 | cr cnu|||unuuu | ||
008 | 210504s2021 gw ob 001 0 eng d | ||
040 |
_aDG1 _beng _erda _epn _cDG1 _dOCLCO _dYDX _dUKAHL |
||
019 |
_a1243743465 _a1245420582 |
||
020 |
_a9783527824199 _q(electronic bk.) |
||
020 |
_a3527824197 _q(electronic bk.) |
||
020 | _z9783527346684 | ||
020 |
_a9783527824182 _q(electronic bk.) |
||
020 |
_a3527824189 _q(electronic bk.) |
||
020 | _z3527346686 | ||
024 | 7 |
_a10.1002/9783527824199 _2doi |
|
029 | 1 |
_aAU@ _b000069150886 |
|
035 |
_a(OCoLC)1249564453 _z(OCoLC)1243743465 _z(OCoLC)1245420582 |
||
050 | 4 | _aTK7871.85 | |
082 | 0 | 4 |
_a621.3815/2 _223 |
049 | _aMAIN | ||
100 | 1 |
_aLill, Thorsten, _eauthor. _99889 |
|
245 | 1 | 0 |
_aAtomic layer processing : _bsemiconductor dry etching technology / _cThorsten Lill. |
264 | 1 |
_aWeinheim, Germany : _bWiley-VCH, _c2021. |
|
300 | _a1 online resource. | ||
336 |
_atext _btxt _2rdacontent |
||
337 |
_acomputer _bc _2rdamedia |
||
338 |
_aonline resource _bcr _2rdacarrier |
||
505 | 0 | _aIntroduction -- Fundamentals -- Thermal Etching -- Thermal Isotropic ALE -- Radical Etching -- Directional ALE -- Reactive Ion Etching -- Ion Beam Etching -- Etching Species Generation -- Emerging Etching Technologies. | |
504 | _aIncludes bibliographical references and index. | ||
588 | 0 | _aOnline resource; title from PDF title page (John Wiley, viewed May 4, 2021). | |
590 | _bWiley Frontlist Obook All English 2021 | ||
650 | 0 |
_aSemiconductors _xEtching. _99890 |
|
655 | 4 |
_aElectronic books. _93294 |
|
776 | 0 | 8 |
_cOriginal _z3527346686 _z9783527346684 _w(OCoLC)1083134617 |
856 | 4 | 0 |
_uhttps://doi.org/10.1002/9783527824199 _zWiley Online Library |
942 | _cEBK | ||
994 |
_a92 _bDG1 |
||
999 |
_c69538 _d69538 |